EXHIBITOR DETAILS: Stand 10B39
EDER Engineering GmbH
Eder Engineering will display the latest version of EDDS – Eder’s patented drawing die-data storage/reading system.
For processing diamond/PCD wire
drawing dies/die workshop equipment:
the USP-115 P – an easy to operate, powerful semi-automatic ultrasonic machine developed for the large PCD die work range 1–20.0mm Ø; the new USP-Twin – the first ultrasonic machine with two workstations incoporated that can be operated by just one person; HGM-21 – a twin-spindle high-speed wire-type sizing/calibrating machine with two independent workstations and extended work range; UFW-1 – fine wire-type sizing/polishing machine for ultrafine die-bores.
Company: |
EDER Engineering GmbH |
Country: |
Austria |
Fax: |
+43 1 367 49 49 49 |
Email: |
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Website: |