EXHIBITOR DETAILS: Stand 10B02
Kieselstein GmbH
Kieselstein is literally on the cutting edge of technology for the draw-peeling of wire. The company works with university partners and research facilities to
analyse and further develop innovative machines.
Kieselstein is especially interested in applications at the quality end of the wire market, for instance high endurance stressed springs for automotive engineering.
The machining operation of draw-peeling allows the removal of surface decarburised layers, roll cracks, score marks and pores. Kieselstein says: “The result is a faultless and a very smooth surface with Ra values smaller than 0.24µm and a nearly homogenous structure.”
The drawing force can be applied by both a vertical (hanging) and a horizontal drawing capstan. The draw-peeling device which is considered the key element
will be on the stand.
In this draw-peeling unit the wire is peeled after a preceding calibrating draft. The chips developing at the cir-cumference of the draw-peeling die are smashed by a circulating cutter. Handling will be significantly eased by automatic feeding equipment and a hydraulically working pulling-in dog.
Company: |
Kieselstein GmbH |
Country: |
Germany |
Fax: |
+49 371 866 2675 |
Email: |
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Website: |